Nippon Paint Advanced Coating Technology

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June 7, 2000
Nippon Paint's full-scale photosensitive epoxy resin film production commences
"Probicote Film" photosensitive epoxy resin film developed by Nippon Paint Co., Ltd. has recently been selected by NGK Spark Plug Co., Ltd. for use as insulation material in semiconductor package production. Nippon Paint commenced full-scale film production this spring.
As information technology rapidly develops, demand for cellular phones, personal computers and game machines steadily rises, presenting global high growth market potential.
"Probicote Film" is a key material in the manufacture of printed wiring boards (PWBs) using the latest build-up process. Designed to layer circuits three-dimensionally to achieve a more compact PWB configuration, this build-up process is considered the most advanced technology for PWB production and semiconductor packaging.
To meet increasing demands for lower cost and lighter weight configuration, semiconductor manufacturers began to replace ceramic MPU packages with organic resin-based packages. In line with this manufacturing trend, NGK Spark Plug has developed a highly reliable package using organic materials, well-suited for high-speed signal processing and high-density wiring. This product is now being supplied in large volume to leading semiconductor manufacturers around the world.
Developed by Nippon Paint for use in organic semiconductor packages, "Probicote Film" is a dry film type insulation material possessing excellent performance qualities not available in conventional liquid photopolymers as well as films for laser processing. This film has undergone exacting field tests including repeated low-and-high temperature cycle testing and insulation property testing from as far back as two years ago, successfully meeting all specified requirements. Incorporating "Probicote Film" in semiconductor packages was possible due to NGK Spark Plug's recognition of Nippon Paint's advanced technology and superb product performance. The current market for plastic packages in Japan is worth 300 billion yen, and this is expected to achieve greater than three-fold growth in the upcoming five years.
The rapid growth projection of the information and communications industry determined Nippon Paint's decision to promote the development of higher performance insulation materials that can accurately meet requirements for next-generation organic packages. This course of action reflects Nippon Paint's aim to strengthen its functional coating business by utilizing its advanced paint technology with the goal of achieving 5 billion yen of sales in electronic materials in five years time.
For further inquiries, please contact:
Nippon Paint Co., Ltd. Corporate Communication Division
Fax: +81 (6) 6455-9278
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